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Matches in SemOpenAlex for { <https://semopenalex.org/work/W1980980279> ?p ?o ?g. }

• W1980980279 abstract "The sealing mechanism of silicon bonding interfaces is reported as a function of annealing temperature. Details of the structural and chemical interface evolution are obtained for hydrophilic silicon/silicon and silicon/silicon dioxide wafer bonding, using x-ray reflectivity and infrared spectroscopy. A two-step mechanism is demonstrated: first a partial sealing of the interface driven by cross-wafer silanol bond condensation and second a water evacuation via oxide formation at the silicon oxide interface." @default.
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• W1980980279 date "2008-12-15" @default.
• W1980980279 modified "2023-09-30" @default.
• W1980980279 title "Hydrophilic low-temperature direct wafer bonding" @default.
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• W1980980279 doi "https://doi.org/10.1063/1.3040701" @default.
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