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• W1981013200 endingPage "4747" @default.
• W1981013200 startingPage "4744" @default.
• W1981013200 abstract "Why does boron doping improve the room temperature ductility of polycrystalline ${mathrm{Ni}}_{3}mathrm{Al}$? Besides preventing environmental embrittlement, B changes the fracture mode from intergranular to transgranular, suggesting an increase in the cohesive strength of the grain boundaries. This change in bonding at the grain boundary has been measured using spatially resolved electron energy loss spectroscopy. The Ni ${L}_{2,3}$ core edge, which is sensitive to the filling of the Ni $d$ band, shows that only the B-rich regions of the grain boundary have a bonding similar to that of the bulk material. These changes suggest a simple model to describe the cohesion of the boundary." @default.
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• W1981013200 date "1995-12-25" @default.
• W1981013200 modified "2023-09-27" @default.
• W1981013200 title "Near Atomic Scale Studies of Electronic Structure at Grain Boundaries in N<mml:math xmlns:mml=http://www.w3.org/1998/Math/MathML display=inline><mml:mrow><mml:msub><mml:mrow><mml:mi mathvariant=normal>i</mml:mi></mml:mrow><mml:mrow><mml:mn>3</mml:mn></mml:mrow></mml:msub></mml:mrow></mml:math>Al" @default.
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• W1981013200 doi "https://doi.org/10.1103/physrevlett.75.4744" @default.
• W1981013200 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/10059986" @default.
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