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• W1981109453 abstract "Recently, as integration density of electrical devices has increased, multi-layered, fine-patterned printed circuit board (PCB) technology has been advancing. As a high-volume, low-cost manufacturing method, PCB fabrication by imprinting has gained much attention. A large-sized Ni stamp plays a critical role in this method. We thus developed a novel fabrication method for a large-sized multi-level Ni stamp, which imprints patterns directly onto PCB resin, using multi-level patterning of an SU-8 photoresist. In this study, we focused on two aspects: (i) the property of SU-8 adhering to a large-sized glass substrate and (ii) neat and complete removal of SU-8 from the Ni stamp using a self-assembled monolayer. Using the processes we developed which will be described in detail in this paper, we successfully demonstrated a multi-level Ni stamp as large as 190 mm × 190 mm in size. The actual imprinting test exhibited successful results showing suitability of the developed method for large-scale, low-cost and high-volume manufacturing of the advanced PCBs." @default.
• W1981109453 created "2016-06-24" @default.
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• W1981109453 date "2011-05-11" @default.
• W1981109453 modified "2023-10-17" @default.
• W1981109453 title "Fabrication of a large-scale Ni stamp using a multi-level SU-8 photoresist mold for advanced printed circuit board manufacturing" @default.
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• W1981109453 doi "https://doi.org/10.1088/0960-1317/21/6/065026" @default.
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