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- W1981504931 abstract "This paper focuses on production scheduling for a MEMS (Microelectromechanical Systems) manufacturing company. The fabrication process used in the company is based on SCREAM (single-crystal reactive etching and metallization) technology, and the whole process can be organized as three subprocesses: the front-end process, the wafer cap process, and the back-end process. Raw wafers are initially released to two parallel subprocesses, the front-end and the wafer cap process, with a batch size of 18. On completion of all the operations in the front-end process, each wafer has to be bonded with a corresponding wafer from the wafer cap process at the bonding station. The bonded wafers are then processed in the back-end process individually instead of in batches. As the total processing time of the front-end process is significantly longer than that of the wafer cap process, the coordination between the releases of wafers to these two subprocesses is an important issue. Ineffective coordination will create longer cycle time and higher WIP (work-in-process). In this paper, five synchronization rules (or coordination rules) for the releases of wafers are developed and are evaluated together with five release rules and six dispatching rules. The simulation results indicate that release rules, synchronization rules, and dispatching rules have significant impact on the performance of this specific MEMS manufacturing system and that all must be considered together to achieve the best performance." @default.
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- W1981504931 date "2002-01-01" @default.
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- W1981504931 title "Production scheduling of a MEMS manufacturing system with a wafer bonding process" @default.
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- W1981504931 doi "https://doi.org/10.1016/s0278-6125(02)80168-6" @default.
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