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• W1981536142 abstract "The features of structure and thermal stability of submicron grained copper and nickel processed by severe plastic deformation are considered. The results of studies by various techniques: transmission electron microscopy, X-ray diffraction, differential scanning calorimetry, electrical resistance and microhardness are presented. The investigations have shown that thermal stability of submicron grained materials is determined not only by a mean grain size but also by the density and distribution of the grain boundary dislocations. The relaxation of the grain boundary dislocations precedes the grain growth starting at 175°C and influences on thermal stability." @default.
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• W1981536142 date "1997-09-01" @default.
• W1981536142 modified "2023-10-03" @default.
• W1981536142 title "Thermal stability of submicron grained copper and nickel" @default.
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• W1981536142 doi "https://doi.org/10.1016/s0921-5093(97)00107-x" @default.
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