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- W1981904268 abstract "In this paper, silicon direct bonding was performed by two different cleaning processes, and the bonding quality was obtained by tensile test and IR test. For (100) P-type double side polished wafer, the optimum process condition was established with respect to the results of two different cleaning processes. The cleaning process of NH3•H2O/H2O2/H2O (Standard Cleaning 1, SC1) after the H2SO4/H2O2 (piranha solution) was found to be better suited for high bonding quality. The bonding strength of the SC1-cleaned samples is about 5.4 MPa with partially crack but no more than 0.7 MPa for the only piranha solution cleaned samples." @default.
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- W1981904268 date "2011-09-01" @default.
- W1981904268 modified "2023-09-26" @default.
- W1981904268 title "Mechanical Strength Characterization for Silicon-to-Silicon Direct Bonding" @default.
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- W1981904268 doi "https://doi.org/10.4028/www.scientific.net/amm.105-107.1662" @default.
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