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- W1982845048 abstract "Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-Error-Rate (BER), depends on assembly and synchronization accuracy we performed a statistical analysis of assembly procedures and communication circuits. In this paper we present a yield prediction methodology for 3D capacitive links: starting from the analysis of communication circuits and BER measurements, we analyze stacking variability in order to predict reliability and performance. The proposed parametric yield analysis is demonstrated on a test-case, with constrained inter-electrode coupling and operating frequency." @default.
- W1982845048 created "2016-06-24" @default.
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- W1982845048 date "2006-01-01" @default.
- W1982845048 modified "2023-09-23" @default.
- W1982845048 title "Yield prediction for 3D capacitive interconnections" @default.
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- W1982845048 doi "https://doi.org/10.1145/1233501.1233667" @default.
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