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• W1983069080 abstract "AlTiN films with different nitrogen partial pressures were deposited using arc ion plating (AIP) technique. In this study, we systematically investigated the effect of the nitrogen partial pressure on composition, deposition efficiency, microstructure, macroparticles (MPs), hardness and adhesion strength of the AlTiN films. The results showed that with increasing the nitrogen partial pressure, the deposition rate exhibited a maximum at 1.2 Pa. Results of X-ray photoelectron spectroscopy (XPS) analysis revealed that AlTiN films were comprised of Ti–N and Al–N bonds. XRD results showed that the films exhibited a (1 1 1) preferred growth, and AlTi3N and TiAlx phases were observed in the film deposited at 1.7 Pa. Analysis of MPs statistics showed MPs decreased with the increase in the nitrogen partial pressure. In addition, the film deposited at 1.2 Pa possessed the maximum hardness of 38 GPa and the better adhesion strength." @default.
• W1983069080 created "2016-06-24" @default.
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• W1983069080 date "2011-12-01" @default.
• W1983069080 modified "2023-09-25" @default.
• W1983069080 title "Effect of nitrogen partial pressure on Al–Ti–N films deposited by arc ion plating" @default.
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• W1983069080 doi "https://doi.org/10.1016/j.apsusc.2011.10.053" @default.
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