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- W1983551645 abstract "We report effects of biaxially applied stress on the electromigration-driven motion of morphologically stable voids in elastically deforming metallic thin films based on self-consistent numerical simulations of void evolution. We find that under certain electromechanical conditions, the applied stress can cause substantial deceleration of the electromigration-driven void motion, as measured by the migration speed of morphologically stable voids translating along the metallic thin film. This effect reveals a new aspect of the complex evolution of voids in metallic thin films under the action of external fields: deceleration of electromigration-driven void motion and even complete inhibition of such motion may be possible through application of mechanical stress." @default.
- W1983551645 created "2016-06-24" @default.
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- W1983551645 date "2007-03-15" @default.
- W1983551645 modified "2023-10-16" @default.
- W1983551645 title "Stress-induced deceleration of electromigration-driven void motion in metallic thin films" @default.
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- W1983551645 doi "https://doi.org/10.1063/1.2709616" @default.
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