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- W1983578751 abstract "Abstract The incorporation of aluminium from contact pads during electromigration experiments with MoSi 2 interconnect lines was investigated. The experimental results prove that once incorporated into the lines, the atomic electrodiffusion of aluminium follows grain boundary paths through the via. In this work, we have isolated the effects of microstructure on the migration behavior. While in lines with a polygranular structure the Al-atoms followed the continuous grain boundary path along the length of the entire interconnect line and accumulated on the anode contact pad, lines with a near-bamboo grain structure showed aluminium extrusion through the liner of the capping layer. The dielectric cracking at discrete spots is the consequence of the build-up of compressive stress σ in front of large ‘near-bamboo’ grains, which is relieved by a positive mass flux to the surface of the interconnect line at ‘grain-boundary’ outlets, as soon as a yield value of σ is reached in front of a blocking grain." @default.
- W1983578751 created "2016-06-24" @default.
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- W1983578751 date "2002-11-01" @default.
- W1983578751 modified "2023-10-14" @default.
- W1983578751 title "Migration-forced metal extrusion from passivated molybdenum disilicide interconnects" @default.
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- W1983578751 doi "https://doi.org/10.1016/s0167-577x(02)00698-5" @default.
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