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- W1983584080 abstract "The development of fabrication techniques for optical components and hybrid assemblies based on flip-chip bonding is outlined. It is argued that the solder-bump technique offers self-alignment, ruggedness, and potentially low manufacturing cost to integrated optics, semiconductor lasers, and optical interconnect devices. Examples of applying flip-chip solder bonding to these devices are presented.< <ETX xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>></ETX>" @default.
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- W1983584080 title "Flip-chip bonding optimizes opto-ICs" @default.
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