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- W1983674443 abstract "Ni/Au microcones were fabricated and thermosonic bonded with Au wire. The thickness of Au film was only 0.05μm. The substrate with Ni/Au microcones showed good Au wire bondability with the average pull strength 4.85 gf and ball shear strength 54.33 gf. Microscopi observation showed that Ni/Au microcones were inserted into Au wire, thus physical interlock between the substrate and Au wire was formed. High temperature storage showed a perfect reliability." @default.
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- W1983674443 date "2013-08-01" @default.
- W1983674443 modified "2023-09-26" @default.
- W1983674443 title "Substrate with Ni/Au microcones surface for wire bonding" @default.
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- W1983674443 doi "https://doi.org/10.1109/icept.2013.6756440" @default.
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