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- W1985538553 abstract "A systematic multidisciplinary electronics packaging design and optimization methodology, which takes into account the complexity of multiple design trade-offs, operated in conjunction with the artificial neural networks (ANNs) technique is presented. To demonstrate its capability, this method is applied to a plastic ball grid array package design. Multidisciplinary criteria including thermal, structural, electromagnetic leakage, and cost are optimized simultaneously using key design parameters as variables. A simplified routability criterion is also considered as a constraint. ANNs are used for thermal and structural performance predictions which resulted in large reduction in computational time. The present methodology is able to provide the designers a tool for systematic evaluation of the design trade-offs which are represented in the objective function. This methodology can be applied to any electronic product design at any packaging level from the system level to the chip level." @default.
- W1985538553 created "2016-06-24" @default.
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- W1985538553 date "2004-11-16" @default.
- W1985538553 modified "2023-09-26" @default.
- W1985538553 title "A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks" @default.
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- W1985538553 doi "https://doi.org/10.1115/1.1997161" @default.
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