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• W1987882755 abstract "The residual stress and its evolution with time in poly(vinylidene-fluoride-co-trifluoroethylene) (P(VDF-TrFE) (72/28)) piezoelectric polymer thin films deposited on silicon wafers were investigated using the wafer curvature method. Double-side polished silicon wafers with minimized initial wafer warpage were used to replace single-side polished silicon wafers to obtain significantly improved reliability for the measurement of the low residual stress in the P(VDF-TrFE) polymer thin films. Our measurement results showed that all the P(VDF-TrFE) films possessed a tensile residual stress, and the residual stress slowly decreased with time. Our analysis further indicates that the tensile stress could arise from the thermal mismatch between the P(VDF-TrFE) film and the silicon substrate. Besides possible viscoelastic creep mechanism in thermoplastic P(VDF-TrFE) films, microcracks with widths in the range of tens of nanometers appeared to release the tensile residual stress." @default.
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• W1987882755 date "2010-12-01" @default.
• W1987882755 modified "2023-10-16" @default.
• W1987882755 title "Residual stress in piezoelectric poly(vinylidene-fluoride-co-trifluoroethylene) thin films deposited on silicon substrates" @default.
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• W1987882755 doi "https://doi.org/10.1016/j.tsf.2010.09.042" @default.
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