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- W1988363542 abstract "The physical phenomenon electromigration (EM) and computer simulation methods of EM in microelectronics devices have been reviewed. A multi-physics EM simulation method which can be used to predict voids appearance in conductors has been described and its relevant challenges have been discussed. The optimizing methods for nano-packaging are discussed in this work and shunt structure for solder joint is proposed and been verified to have a significant potential to resist EM by our model." @default.
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- W1988363542 date "2013-08-01" @default.
- W1988363542 modified "2023-09-22" @default.
- W1988363542 title "Electromigration aware design for nano-packaging" @default.
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- W1988363542 doi "https://doi.org/10.1109/nano.2013.6720970" @default.
- W1988363542 hasPublicationYear "2013" @default.
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