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- W1988649604 abstract "For future high-speed and high-density opto-electronic multi-chip module (OE-MCM) packaging, we developed two advanced transferred microsolder bump bonding techniques. One uses 80% Au-Sn, which allows module packaging using processes at various temperatures because it has a higher melting temperature than 100% In and 60% Sn-Pb solders. The other uses multiple transfers of bumps to achieve accurate three-dimensional flip-chip bonding with precise vertical and horizontal alignments within an error of /spl plusmn/0.5 /spl mu/m. These techniques will thus be very useful in developing high-speed and high-density OE-MCM's for multi-functional board-level interconnection in future optical communication systems." @default.
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- W1988649604 date "2000-06-01" @default.
- W1988649604 modified "2023-09-25" @default.
- W1988649604 title "Advanced flip chip bonding techniques using transferred microsolder bumps" @default.
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- W1988649604 doi "https://doi.org/10.1109/6144.846781" @default.
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