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- W1988735353 abstract "In this paper, we present the results of study of stress distribution in a semiconductor film bonded to a LiNbO3 substrate by X-ray topographic analysis. We discuss the dynamics of stress distribution in a bonded semiconductor film subjected to local heating treatments for the first time. The local heating treatments, such as microwave heating and laser scanning heating, are effective for obtaining a large bonding strength. In addition to the heating methods, we investigate the effect of other methods, such as pressing during low-temperature heating. Also, we compare the stress distribution in semiconductor film due to direct bonding, indirect bonding and an etching process. The experimental results revealed the change of the stress distribution due to process conditions. It is therefore necessary to optimize the process conditions for fabricating semiconductor coupled surface acoustic wave (SAW) devices." @default.
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- W1988735353 date "2002-06-15" @default.
- W1988735353 modified "2023-09-25" @default.
- W1988735353 title "X-Ray Analysis of Stress Distribution in Semiconductor Films Bonded to a Piezoelectric Substrate" @default.
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- W1988735353 doi "https://doi.org/10.1143/jjap.41.4000" @default.
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