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- W1988855707 abstract "A simple and efficient packaging technique with aluminium-core printed circuit board component embedded copper reflectors is presented for fabricating high-power white light emitting diode (LED) arrays. Three-dimensional finite element simulation and dynamic infrared imaging for analysis of the packaged nine-chips LED array are carried out to investigate the thermal and optical properties. The results show the method, which obtained a luminous efficiency of 126 lm/W and thermal resistance of 3.4 K/W, is suitable for high efficiency and low-cost LED based solid-state lighting." @default.
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- W1988855707 date "2011-01-01" @default.
- W1988855707 modified "2023-10-11" @default.
- W1988855707 title "Multiple-chip package embedded on compound board for light emitting diode" @default.
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- W1988855707 doi "https://doi.org/10.1049/el.2011.1783" @default.
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