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• W1989276861 abstract "The effect of polyethylene glycol (PEG) molecular weight (Mw) upon the microhole filling by Cu electrodeposition was investigated by cross-sectional images using optical microscopy. The bottom-up filling capability of the electroplating bath was increased clearly with an increase in PEG Mw from 600 to 8000 g mol–1, and holes with a diameter of 50 μm and aspect ratio of one were filled completely when PEG Mw was higher than 6000 g mol–1. The electrochemical study indicated that the polarisation on the cathode was increased with an increase in PEG Mw, and the Cu deposition rate was inhibited. Furthermore, X-ray diffraction analyses showed the crystallography and the peak intensity ratio I(111)/I(200) of plated Cu film were decreased with an increase in PEG Mw. The surface roughness of deposited Cu film was decreased, and a smooth surface was obtained as the PEG Mw increased. The results present PEG-8000 as an inhibitor which is beneficial for microholes filling for high density interconnections printed circuit board." @default.
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• W1989276861 date "2010-05-01" @default.
• W1989276861 modified "2023-10-14" @default.
• W1989276861 title "Effect of PEG molecular weight on bottom-up filling of copper electrodeposition for PCB interconnects" @default.
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• W1989276861 doi "https://doi.org/10.1179/174591910x12692711390390" @default.
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