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• W1989560308 abstract "Abstract To evaluate the influence of a printed wiring board (PWB) with a high coefficients of thermal expansion (CTE) on the thermal deformation of a small outline J-leaded electronic package (SOJ), a newly developed phase-shifting method was applied to moire interferometry. This phase-shifting moire interferometry method uses a wedged glass plate as a phase shifter to obtain displacement fields with a sensitivity of 100 nm/line. This technique also enabled the quantitative determination of strain distributions in all observation areas. Thermal loading was applied from room temperature (25 °C) to an elevated temperature (100 °C), and then the thermal strains of SOJ with and without the PWB were compared. The results showed that the concentrations of the longitudinal strains e xx and e yy became increasingly prominent when mounted on the PWB, and the shear strains γ xy were concentrated at the corners of the silicon chip. The values of these strains increased by about 50% when the SOJ was mounted on the PWB." @default.
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• W1989560308 date "2008-01-01" @default.
• W1989560308 modified "2023-09-26" @default.
• W1989560308 title "Experimental analysis of thermal displacement and strain distributions in a small outline J-leaded electronic package by using wedged-glass phase-shifting moiré interferometry" @default.
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• W1989560308 doi "https://doi.org/10.1016/j.optlaseng.2007.08.007" @default.
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