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- W1989880008 abstract "Purpose – The purpose of the paper is to present an update and the latest results from work on a project which could be useful for maskless printed circuit board (PCB) manufacturing.Design/methodology/approach – Copper is plated and etched using a novel electrochemical technique, electrochemical patterning by flow and chemistry, using a masked tool and fully exposed substrate. The micro patterns on the tool are replicated on the substrate via optimum design of the apparatus, choice of electrolyte chemistry and fluid flow.Findings – Linear and square shapes ranging from 5 to 200 μm are transferred using the technique by electrochemical plating and etching. Up to 25 substrates could be processed using a single tool, which indicates that photolithography requirements can be greatly minimised.Research limitations/implications – The copper lines are transferred to relatively small substrates. The process needs to be scaled up to accommodate larger substrates in order to fully exploit its potential for PCBs.Ori..." @default.
- W1989880008 created "2016-06-24" @default.
- W1989880008 creator A5055159131 @default.
- W1989880008 date "2009-08-21" @default.
- W1989880008 modified "2023-09-26" @default.
- W1989880008 title "EnFACE: a maskless process for circuit fabrication" @default.
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- W1989880008 doi "https://doi.org/10.1108/03056120910979495" @default.
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