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- W1991336496 abstract "Presented in this paper is a realization of Multi-Layer Substrate with 30<mml:math xmlns:mml=http://www.w3.org/1998/Math/MathML><mml:mi>μ</mml:mi></mml:math>m signal pattern width and 100<mml:math xmlns:mml=http://www.w3.org/1998/Math/MathML><mml:mi>μ</mml:mi></mml:math>m square via holes on a 100 mm square ceramic substrate. To obtain this fine signal pattern width, a thin film technique, “GSP” process, has been applied on a thick film dielectric layer. For the 100<mml:math xmlns:mml=http://www.w3.org/1998/Math/MathML><mml:mi>μ</mml:mi></mml:math>m square via holes through the thick film dielectric, a new thick film technique, “DD” process, has been developed utilizing a photolithographic technique. This paper describes the processes and the results obtained by the method." @default.
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- W1991336496 date "1981-01-01" @default.
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- W1991336496 title "Combination of Thick-Film Dielectric/Thin Film Conductor for Fine Pattern Formation of Multi-Layer Substrate" @default.
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- W1991336496 doi "https://doi.org/10.1155/apec.8.235" @default.
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