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- W1991447310 abstract "Abstract To obtain a AL/PZT/Pt/Ti ferroelectric capacitor, Reactive Ion Etching (RIE) of Pb(Zr,Ti)O3 ferroelectric thin films and Pt bottom electrode with SF6/Ar plasmas is described in this work. The etch rate of PZT and Pt under different power, SF6/Ar gas flow ratio and gas pressure were studied. It's shown that there exists an optimum power, SF6/Ar gas flow ratio and pressure to etch PZT and Pt, respectively. Etch rates of the order of 2–7 nm/min were obtained under different conditions." @default.
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- W1991447310 date "1999-06-01" @default.
- W1991447310 modified "2023-09-26" @default.
- W1991447310 title "Reactive Ion Etching of Sol-Gel derived PZT thin film and Pt/Ti bottom electrode for FRAM" @default.
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- W1991447310 doi "https://doi.org/10.1080/00150199908015769" @default.
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