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• W1991618368 abstract "New aromatic silicon-containing poly(imide-amide)s have been synthesized by solution polycondensation of various aromatic diamines having ether bridges between phenylene rings with a diacid chloride containing silicon. These polymers are easily soluble in polar amidic solvents such as N-methyl-pyrrolidinone or dimethylformamide and can be cast into thin flexible films or coatings from such solutions. They show high thermal stability, with an initial decomposition temperature above 410°C and a glass transition temperature in the range of 251-285°C. Very thin polymer films deposited by the spincoating technique onto silicon wafers showed a smooth, pinhole-free surface in atomic force microscopy investigations." @default.
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• W1991618368 date "2003-09-01" @default.
• W1991618368 modified "2023-10-18" @default.
• W1991618368 title "New Silicon-Containing Poly(Imide-Amide)s" @default.
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• W1991618368 doi "https://doi.org/10.1177/0954008303015003010" @default.
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