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- W1991686650 abstract "Until recently, electronically addressable devices such as ferrite core, plated wire, semiconductor memories, and electromechanically addressable devices such as magnetic tapes, disks, and drums were the few technologies from which a computer system designer could build a memory system. A number of different new technologies and devices have been developed that close the access gap <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>14</sup> between the two dissimilar technologies mentioned above. These include charge-coupled devices (CCD's), <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> bubble memories, <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>4</sup> electron beam addressed memories (EBAM), <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>17</sup> and domain tip propagation (DOT). <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>16</sup> Other technologies like CMOS <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>1</sup> and integrated injection logic (I <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>2</sup> L), <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>9</sup> compete directly with the existing technologies. Table 1 (see p. 46) shows the possibility of a six-level hierarchy and some cost and performance projections for these technologies." @default.
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- W1991686650 date "1976-04-01" @default.
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- W1991686650 title "Cost, Performance, and Size Tradeoffs for Different Levels in a Memory Hierarchy*" @default.
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