Matches in SemOpenAlex for { <https://semopenalex.org/work/W1992151282> ?p ?o ?g. }
Showing items 1 to 88 of
88
with 100 items per page.
- W1992151282 endingPage "369" @default.
- W1992151282 startingPage "363" @default.
- W1992151282 abstract "Cooling rate is an important parameter in solder reflow process because it influences not only microstructure of solder alloy but also the morphology and growth of intermetallic compounds (IMC) formed between solder and its metallization. All these ultimately affect the mechanical integrity of the joint. In this work, the effect of cooling rate on IMC growth is studied in Sn–3.5 Ag solder/Ni–P under bump metallization (UBM) system. Morphology and growth kinetics of the formed Ni3Sn4 IMC under different cooling rates are studied. Needle-type, boomerang-type and chunk-type of Ni3Sn4 IMCs have been observed between solder and Ni–P UBM under various cooling conditions. The amount of the needle-type and boomerang-type grains decreases with the increase of reflow time. Prolonged reflow results in continuous layer of chunk-type IMC grains with no obvious effect from the cooling rate. Samples with different post-reflow cooling rate are further annealed. It is found that the IMC layer thickness increases faster in samples under fast cooling rate than the slow ones under the same annealing condition." @default.
- W1992151282 created "2016-06-24" @default.
- W1992151282 creator A5002799029 @default.
- W1992151282 creator A5015642735 @default.
- W1992151282 creator A5031908321 @default.
- W1992151282 creator A5064426002 @default.
- W1992151282 creator A5082230753 @default.
- W1992151282 date "2004-09-01" @default.
- W1992151282 modified "2023-10-16" @default.
- W1992151282 title "Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization" @default.
- W1992151282 cites W1967210957 @default.
- W1992151282 cites W1969319609 @default.
- W1992151282 cites W1992975792 @default.
- W1992151282 cites W2000777957 @default.
- W1992151282 cites W2017959119 @default.
- W1992151282 cites W2019209191 @default.
- W1992151282 cites W2025041876 @default.
- W1992151282 cites W2025700207 @default.
- W1992151282 cites W2030957321 @default.
- W1992151282 cites W2078109311 @default.
- W1992151282 cites W2155201281 @default.
- W1992151282 doi "https://doi.org/10.1016/j.tsf.2004.05.045" @default.
- W1992151282 hasPublicationYear "2004" @default.
- W1992151282 type Work @default.
- W1992151282 sameAs 1992151282 @default.
- W1992151282 citedByCount "36" @default.
- W1992151282 countsByYear W19921512822012 @default.
- W1992151282 countsByYear W19921512822013 @default.
- W1992151282 countsByYear W19921512822014 @default.
- W1992151282 countsByYear W19921512822015 @default.
- W1992151282 countsByYear W19921512822016 @default.
- W1992151282 countsByYear W19921512822020 @default.
- W1992151282 countsByYear W19921512822021 @default.
- W1992151282 countsByYear W19921512822023 @default.
- W1992151282 crossrefType "journal-article" @default.
- W1992151282 hasAuthorship W1992151282A5002799029 @default.
- W1992151282 hasAuthorship W1992151282A5015642735 @default.
- W1992151282 hasAuthorship W1992151282A5031908321 @default.
- W1992151282 hasAuthorship W1992151282A5064426002 @default.
- W1992151282 hasAuthorship W1992151282A5082230753 @default.
- W1992151282 hasBestOaLocation W19921512822 @default.
- W1992151282 hasConcept C159985019 @default.
- W1992151282 hasConcept C191897082 @default.
- W1992151282 hasConcept C192562407 @default.
- W1992151282 hasConcept C2524010 @default.
- W1992151282 hasConcept C27501479 @default.
- W1992151282 hasConcept C2777855556 @default.
- W1992151282 hasConcept C2778312390 @default.
- W1992151282 hasConcept C2778413121 @default.
- W1992151282 hasConcept C2779227376 @default.
- W1992151282 hasConcept C2780026712 @default.
- W1992151282 hasConcept C33923547 @default.
- W1992151282 hasConcept C50296614 @default.
- W1992151282 hasConcept C87976508 @default.
- W1992151282 hasConceptScore W1992151282C159985019 @default.
- W1992151282 hasConceptScore W1992151282C191897082 @default.
- W1992151282 hasConceptScore W1992151282C192562407 @default.
- W1992151282 hasConceptScore W1992151282C2524010 @default.
- W1992151282 hasConceptScore W1992151282C27501479 @default.
- W1992151282 hasConceptScore W1992151282C2777855556 @default.
- W1992151282 hasConceptScore W1992151282C2778312390 @default.
- W1992151282 hasConceptScore W1992151282C2778413121 @default.
- W1992151282 hasConceptScore W1992151282C2779227376 @default.
- W1992151282 hasConceptScore W1992151282C2780026712 @default.
- W1992151282 hasConceptScore W1992151282C33923547 @default.
- W1992151282 hasConceptScore W1992151282C50296614 @default.
- W1992151282 hasConceptScore W1992151282C87976508 @default.
- W1992151282 hasLocation W19921512821 @default.
- W1992151282 hasLocation W19921512822 @default.
- W1992151282 hasOpenAccess W1992151282 @default.
- W1992151282 hasPrimaryLocation W19921512821 @default.
- W1992151282 hasRelatedWork W1999552040 @default.
- W1992151282 hasRelatedWork W2014744139 @default.
- W1992151282 hasRelatedWork W2050291672 @default.
- W1992151282 hasRelatedWork W2140971279 @default.
- W1992151282 hasRelatedWork W2267870793 @default.
- W1992151282 hasRelatedWork W2377155807 @default.
- W1992151282 hasRelatedWork W2391379563 @default.
- W1992151282 hasRelatedWork W2542352128 @default.
- W1992151282 hasRelatedWork W2766515653 @default.
- W1992151282 hasRelatedWork W4384103757 @default.
- W1992151282 hasVolume "462-463" @default.
- W1992151282 isParatext "false" @default.
- W1992151282 isRetracted "false" @default.
- W1992151282 magId "1992151282" @default.
- W1992151282 workType "article" @default.