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Matches in SemOpenAlex for { <https://semopenalex.org/work/W1992648511> ?p ?o ?g. }

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• W1992648511 abstract "This article has presented circuit architectures that allow for the 3D integration and on-wafer packaging through the concept of an Si interposer. The presented 3D integration schemes have allowed for the design and fabrication of a fully integrated receiver that performs at 10 GHz. High-Q passives and 3D interconnects allow for the design of low-cost, high-density circuits that also exhibit very high performance" @default.
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• W1992648511 date "2007-02-01" @default.
• W1992648511 modified "2023-10-14" @default.
• W1992648511 title "Heterogeneous Wafer-Scale Circuit Architectures" @default.
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• W1992648511 doi "https://doi.org/10.1109/mmw.2007.316255" @default.
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