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- W1992664133 abstract "Sn-Ag-Cu lead-free solders have recently been applied generally in electrical packaging, but a discoloring of the solders often occurs at the injection-ball or the reflow processes. This study investigates the solidification surface characteristics of both the Sn-3.5Ag alloy and the Sn-3.5Ag-2.0Cu alloy to discuss and clarify the differences in composition between the surface and the thin film of subsurface. The results indicate that the solidification surface films of the Sn-3.5Ag-(2.0Cu) are mostly composed of SnO phase and SnO 2 phase. The concentration of Sn 4+ is higher than that of Sn 2+ on the film. And the binding energy of O atoms increases at sites near the solidification surface. On the solidification surface thin film, the Ag content of the Sn-3.5Ag-2.0Cu specimen is higher than the Sn-3.5Ag specimen. In addition, there is few Cu on the solidification surface film of the Sn-3.5Ag-2.0Cu specimen, and adding Cu into Sn-3.5Ag alloy not only can repress the growth of the SnO x phase but also reducing the degree of discoloring." @default.
- W1992664133 created "2016-06-24" @default.
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- W1992664133 date "2005-01-01" @default.
- W1992664133 modified "2023-10-18" @default.
- W1992664133 title "Thin Film Characteristics of Sn–3.5Ag–(2.0Cu) Alloy" @default.
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- W1992664133 doi "https://doi.org/10.2320/matertrans.46.3020" @default.
- W1992664133 hasPublicationYear "2005" @default.
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