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- W1994488645 abstract "According to the shortcomings of the traditional free abrasive chemical mechanical polishing (CMP), in recent years, the fixed abrasive chemical mechanical polishing (FA-CMP) technology is proposed. It is a new planarization technology developed on the basis of the traditional CMP. Pad is an important and dispensable part in FA-CMP. The cost and quality of FA-CMP pad are determined by the preparation technology. In order to study the FA-CMP pad of the low cost and high quality, in this paper, by reading a lot of literature, 5 kinds of preparation technology of FA-CMP pad are analyzed. Study results will provide some reference for further designing and manufacturing the FA-CMP pad." @default.
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- W1994488645 date "2014-08-01" @default.
- W1994488645 modified "2023-09-25" @default.
- W1994488645 title "Study on the Preparation Technology of Fixed Abrasive Polishing Pad in Chemical Mechanical Polishing" @default.
- W1994488645 cites W2102303014 @default.
- W1994488645 doi "https://doi.org/10.4028/www.scientific.net/amm.602-605.485" @default.
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