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- W1994489293 abstract "The thermal stability of plasma-enhanced chemical-vapor-deposited tungsten nitride (PECVD-W-N) thin film has been investigated as a diffusion barrier between Al or Au and Si during subsequent annealing at 550-850°C. The atomic concentrations of N in as-deposited W 100- x N x films are varied from 0 to 75 at.% corresponding to NH 3 /WF 6 ratio, and their resistivities are varied from 10-460 µΩ·cm. Rutherford backscattering spectrometry, Auger electron depth profiles, X-ray diffraction and transmission electron microscopy show that 900 Å PECVD-W 67 N 33 film interposed between Al or Au and Si is less permeable than sputtered TiN and PECVD-W film due to interstitial N atoms and Si/W 67 N 33 /Au maintaining the integrity of interface while the furnace post annealing is carried out at 850°C for 30 min." @default.
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- W1994489293 date "1993-12-01" @default.
- W1994489293 modified "2023-10-09" @default.
- W1994489293 title "Performance of the Plasma-Deposited Tungsten Nitride Diffusion Barrier for Al and Au Metallization" @default.
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- W1994489293 doi "https://doi.org/10.1143/jjap.32.6126" @default.
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