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- W1995936666 abstract "Various middle- and high-permittivity dielectric material systems for LTCC were examined. By designing several borosilicate glass frit systems carefully, we tried to lower the temperature of densification to 875 °C in selected host dielectric materials still maintaining acceptable dielectric properties. The effects of glass addition on the densification, electrical properties, and phase changes in the host dielectric materials were examined." @default.
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- W1995936666 date "2007-01-01" @default.
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- W1995936666 title "Middle- and high-permittivity dielectric compositions for low-temperature co-fired ceramics" @default.
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- W1995936666 doi "https://doi.org/10.1016/j.jeurceramsoc.2006.05.104" @default.
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