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- W1996095388 abstract "The uni-directional Cu with surface covered by (111) plane can be made by electroplating. The shape of Cu grain was columnar. The diameters of these columnar grains were 2 – 5 µm. After electroplating SnAg2.3 on the Cu pad and then reflowed at 260 oC, the ?-Cu <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</inf> Sn <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</inf> s have shown a preferential growth relationship on the uni-directional Cu. At the early stage of reflowing, the orientations of Cu <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</inf> Sn <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</inf> were preferred at (0001). As the time of reflow extended, the orientations of Cu <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</inf> Sn <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</inf> would change to be preferred at (2113). Since the uni-directional Cu was still poly-crystal metal, the coherence must be achieved by Cu-Sn bonding at the interface between Cu pads and the intermetallics. Electroplating parameters would affect the quality of uni-directional Cu and therefore affecting the preferential behavior of Cu <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</inf> Sn <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</inf> . With the technique of electroplating (111) uni-directional Cu, it is possible to control the orientations of intermetallics in the solder joints." @default.
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- W1996095388 date "2012-10-01" @default.
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- W1996095388 title "The preferential growth of η-Cu<inf>6</inf>Sn<inf>5</inf> on (111) uni-directional Cu pads" @default.
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