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- W1997347158 abstract "Pixelless infrared imaging can be accomplished by epitaxially integrating a light emitting diode (LED) with a quantum well infrared photodetector (QWIP) large area device. The device acts as an infrared image converter by detecting a mid-to-far infrared (M/FIR) signal using the QWIP and outputting a near-infrared (NIR) signal via the integrated LED. By removing the device substrate, the detector performance can be significantly improved. This paper describes a substrate removal process, which uses a combination of mechanical polishing and chemical selective wet-etch. The choice of a suitable optical adhesive and the control of carrier/device parallelism are the two most important factors determining the success of the process." @default.
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- W1997347158 date "2000-02-01" @default.
- W1997347158 modified "2023-10-18" @default.
- W1997347158 title "Substrate removal for improved performance of QWIP–LED devices grown on GaAs substrates" @default.
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- W1997347158 doi "https://doi.org/10.1016/s1350-4495(99)00047-x" @default.
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