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- W1997569855 abstract "In this letter, we investigate the impact of the thermal recovery (annealing) process on the electrical characteristics and the stability of IGZO TFTs in terms of: 1) vertical/lateral diffusion of Ti atoms into the IGZO channel region from the source/drain electrode and 2) recovery or local rearrangement of ions in IGZO. Although low thermal recovery temperatures <;300 °C are required to avoid the Ti diffusion that degrades IGZO TFT electrical characteristics, the TFT devices fabricated below 300 °C becomes very unstable in gate/drain electrical-stresses as a tradeoff." @default.
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- W1997569855 date "2014-08-01" @default.
- W1997569855 modified "2023-10-10" @default.
- W1997569855 title "Impacts of the Thermal Recovery Process on In–Ga–Zn–O (IGZO) TFTs" @default.
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- W1997569855 doi "https://doi.org/10.1109/led.2014.2329911" @default.
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