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- W1997659837 abstract "We have investigated the relationship between contact forces and the fritting which should be utilized for making contact to integrated circuit pads in micromachined wafer probe cards. Micromachined probe cards are requisite to tests of higher pad-density and smaller pad-pitch chips with high-speed signals above 1 GHz. In addition, if a microactuator is integrated into each probe, we can realize a novel probe card in which contacts can directly be switched on and off. The critical problem of the micromachined probe cards, however, is that each micromachined probe cannot generate or endure the force required to break the oxide on an Al pad surface mechanically. To overcome the problem, we planned to reduce the required contact force by putting the fritting effect to good use. For that, in this article, we have measured forces required for making contact to Al pads and contact resistance when utilizing the fritting process for the break of the pad surface oxide. Furthermore, we have also measured the force necessary to disconnect the contact made by the fritting, since it is important to design the probe dimensions and integrated actuators. As a result, we have found that the fritting makes it possible to get low resistance contact to Al pads without applying external forces. Moreover, the contact resistance and the adhesion force, when using electroplated Au bumps as the contact probe, were found to be one-third of those when using electroplated Ni bumps, respectively. This indicates that the Au bump is more suitable for the probe of micromachined probe cards." @default.
- W1997659837 created "2016-06-24" @default.
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- W1997659837 date "2000-05-01" @default.
- W1997659837 modified "2023-10-02" @default.
- W1997659837 title "Characteristics of fritting contacts utilized for micromachined wafer probe cards" @default.
- W1997659837 cites W2119396706 @default.
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- W1997659837 doi "https://doi.org/10.1063/1.1150610" @default.
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