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Matches in SemOpenAlex for { <https://semopenalex.org/work/W1997682824> ?p ?o ?g. }

• W1997682824 endingPage "1547" @default.
• W1997682824 startingPage "1541" @default.
• W1997682824 abstract "Thermal dissipation in power electronics systems is becoming an extremely important issue with the continuous growth of power density in their components. The primary cause of failure in this equipment is excessive temperatures in the critical components, such as semiconductors and transformers. This problem is particularly important in power electronic systems for space applications. These systems are usually housed in completely sealed enclosures for safety reasons. The effective management of heat removal from a sealed enclosure poses a major thermal-design challenge since the cooling of these systems primarily rely on natural convection. In this context, the presented paper treats the heat pipes as effective heat transfer devices that can be used to raise the thermal conductive path in order to spread a concentrated heat source over a larger surface area. As a result, the high heat flux at the heat source can be reduced to a smaller and manageable level that can be dissipated through conventional cooling methods. The objective of our work is to describe the feasibility of a cooling system with miniature heat pipes embedded in a direct bonded copper (DBC) structure. The advantage of this type of heat pipe is the possibility for implementation of the component layout on the heat pipe itself, which eliminates the existence of a thermal interface between the device and the cooling system" @default.
• W1997682824 created "2016-06-24" @default.
• W1997682824 creator A5001200010 @default.
• W1997682824 creator A5021756709 @default.
• W1997682824 creator A5028217556 @default.
• W1997682824 creator A5047790329 @default.
• W1997682824 creator A5076643769 @default.
• W1997682824 date "2006-11-01" @default.
• W1997682824 modified "2023-09-25" @default.
• W1997682824 title "Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging" @default.
• W1997682824 cites W2161856904 @default.
• W1997682824 cites W2567239685 @default.
• W1997682824 doi "https://doi.org/10.1109/tpel.2006.882974" @default.
• W1997682824 hasPublicationYear "2006" @default.
• W1997682824 type Work @default.
• W1997682824 sameAs 1997682824 @default.
• W1997682824 citedByCount "42" @default.
• W1997682824 countsByYear W19976828242012 @default.
• W1997682824 countsByYear W19976828242013 @default.
• W1997682824 countsByYear W19976828242014 @default.
• W1997682824 countsByYear W19976828242015 @default.
• W1997682824 countsByYear W19976828242016 @default.
• W1997682824 countsByYear W19976828242017 @default.
• W1997682824 countsByYear W19976828242018 @default.
• W1997682824 countsByYear W19976828242019 @default.
• W1997682824 countsByYear W19976828242020 @default.
• W1997682824 countsByYear W19976828242021 @default.
• W1997682824 countsByYear W19976828242022 @default.
• W1997682824 countsByYear W19976828242023 @default.
• W1997682824 crossrefType "journal-article" @default.
• W1997682824 hasAuthorship W1997682824A5001200010 @default.
• W1997682824 hasAuthorship W1997682824A5021756709 @default.
• W1997682824 hasAuthorship W1997682824A5028217556 @default.
• W1997682824 hasAuthorship W1997682824A5047790329 @default.
• W1997682824 hasAuthorship W1997682824A5076643769 @default.
• W1997682824 hasConcept C119599485 @default.
• W1997682824 hasConcept C121332964 @default.
• W1997682824 hasConcept C127413603 @default.
• W1997682824 hasConcept C128458982 @default.
• W1997682824 hasConcept C138331895 @default.
• W1997682824 hasConcept C165801399 @default.
• W1997682824 hasConcept C178911571 @default.
• W1997682824 hasConcept C186937647 @default.
• W1997682824 hasConcept C192562407 @default.
• W1997682824 hasConcept C2778952998 @default.
• W1997682824 hasConcept C37728375 @default.
• W1997682824 hasConcept C48632124 @default.
• W1997682824 hasConcept C50517652 @default.
• W1997682824 hasConcept C54791560 @default.
• W1997682824 hasConcept C57879066 @default.
• W1997682824 hasConcept C63024428 @default.
• W1997682824 hasConcept C7694927 @default.
• W1997682824 hasConcept C78519656 @default.
• W1997682824 hasConcept C79795727 @default.
• W1997682824 hasConcept C81060104 @default.
• W1997682824 hasConcept C97355855 @default.
• W1997682824 hasConcept C98375054 @default.
• W1997682824 hasConceptScore W1997682824C119599485 @default.
• W1997682824 hasConceptScore W1997682824C121332964 @default.
• W1997682824 hasConceptScore W1997682824C127413603 @default.
• W1997682824 hasConceptScore W1997682824C128458982 @default.
• W1997682824 hasConceptScore W1997682824C138331895 @default.
• W1997682824 hasConceptScore W1997682824C165801399 @default.
• W1997682824 hasConceptScore W1997682824C178911571 @default.
• W1997682824 hasConceptScore W1997682824C186937647 @default.
• W1997682824 hasConceptScore W1997682824C192562407 @default.
• W1997682824 hasConceptScore W1997682824C2778952998 @default.
• W1997682824 hasConceptScore W1997682824C37728375 @default.
• W1997682824 hasConceptScore W1997682824C48632124 @default.
• W1997682824 hasConceptScore W1997682824C50517652 @default.
• W1997682824 hasConceptScore W1997682824C54791560 @default.
• W1997682824 hasConceptScore W1997682824C57879066 @default.
• W1997682824 hasConceptScore W1997682824C63024428 @default.
• W1997682824 hasConceptScore W1997682824C7694927 @default.
• W1997682824 hasConceptScore W1997682824C78519656 @default.
• W1997682824 hasConceptScore W1997682824C79795727 @default.
• W1997682824 hasConceptScore W1997682824C81060104 @default.
• W1997682824 hasConceptScore W1997682824C97355855 @default.
• W1997682824 hasConceptScore W1997682824C98375054 @default.
• W1997682824 hasIssue "6" @default.
• W1997682824 hasLocation W19976828241 @default.
• W1997682824 hasLocation W19976828242 @default.
• W1997682824 hasLocation W19976828243 @default.
• W1997682824 hasOpenAccess W1997682824 @default.
• W1997682824 hasPrimaryLocation W19976828241 @default.
• W1997682824 hasRelatedWork W143748080 @default.
• W1997682824 hasRelatedWork W1997682824 @default.
• W1997682824 hasRelatedWork W2057901315 @default.
• W1997682824 hasRelatedWork W2200549428 @default.
• W1997682824 hasRelatedWork W2388006997 @default.
• W1997682824 hasRelatedWork W2430816519 @default.
• W1997682824 hasRelatedWork W2777950022 @default.
• W1997682824 hasRelatedWork W3128682889 @default.
• W1997682824 hasRelatedWork W4246498556 @default.
• W1997682824 hasRelatedWork W4300982396 @default.
• W1997682824 hasVolume "21" @default.
• W1997682824 isParatext "false" @default.
• W1997682824 isRetracted "false" @default.

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