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- W1997686985 abstract "This paper uses simulation and experiment to study near resolution limit patterning of contacts and damascene trenches using conventional i-line lithography. Special attention is paid to the requirements for substrate control. The patterning behavior is compared to DUV lithography results. We also evaluate the cost-of-process for an i-line process using substrate and optical enhancements compared to a standard 248 nm DUV process." @default.
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- W1997686985 date "1998-06-08" @default.
- W1997686985 modified "2023-09-23" @default.
- W1997686985 title "Manufacturability of subwavelength features using reticle and substrate enhancements" @default.
- W1997686985 doi "https://doi.org/10.1117/12.308748" @default.
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