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- W1998274133 abstract "Integrated circuit chips of newer technology usually have a larger die size and an increase number of metallization. Hence, pure usage of polishing to remove the layers would induce severe edge rounding. An alternative method is proposed to decrease the polishing time for copper metallization removal while reducing edge rounding on the sample during sample preparation that will preserve the integrity of the layers for further failure analysis." @default.
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- W1998274133 date "2013-07-01" @default.
- W1998274133 modified "2023-09-24" @default.
- W1998274133 title "Uniform delayering of copper metallization" @default.
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- W1998274133 doi "https://doi.org/10.1109/ipfa.2013.6599147" @default.
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