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• W1998577650 abstract "A method of interconnecting micropad electrodes was developed by using the electroless deposition of for application to the flip-chip bonding technology. The phenomenon of bridge formation by the so-called extraneous deposition was utilized as a technique to perform selective deposition of on noncatalytic surfaces. The process of extraneous electroless deposition was controlled by optimizing deposition conditions so that the deposit grew anisotropically along the surface between the facing pads. Practical feasibility of this technique was demonstrated by forming an interconnection between pads separated by and measuring in both height and width. This method was applied successfully to interconnecting the pads forming an array with a pitch of ." @default.
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• W1998577650 date "2007-01-01" @default.
• W1998577650 modified "2023-10-16" @default.
• W1998577650 title "Interconnection of Micropad Electrodes by Controlled “Extraneous” Deposition of Electroless NiB Film" @default.
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• W1998577650 doi "https://doi.org/10.1149/1.2752455" @default.
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