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• W1998722829 abstract "Alloy seedlayers for Cu BEOL interconnects have become common at technology groundrules of 45 nm and below, due to reliability requirements. The key requirement of the minority alloy component (e.g., Al or Mn, also referred to as the “dopant”) is that it segregates to the Cu / dielectric cap layer interface in order to promote adhesion between the Cu in the line and the dielectric capping layer. The segregation beneath the dielectric cap has a complex dependence on many process parameters and needs to be monitored across the wafer. In this paper, we present a contactless, in-line, fast and reliable Kelvin probe technique for the sub-surface detection of alloy segregation in Cu interconnects for sub-22 nm technologies." @default.
• W1998722829 created "2016-06-24" @default.
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• W1998722829 date "2014-05-01" @default.
• W1998722829 modified "2023-10-12" @default.
• W1998722829 title "Assessment of minority-alloy component segregation (e.g. Mn, Al) in back end of line copper trench structures using Kelvin probe technique" @default.
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• W1998722829 doi "https://doi.org/10.1109/asmc.2014.6847017" @default.
• W1998722829 hasPublicationYear "2014" @default.
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