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• W1999349731 abstract "Cu(Mn) alloy seed BEOL studies revealed fundamental insights into Mn segregation and EM enhancement. We found a metallic-state Mn-rich Cu layer under the MnOx layer at the Cu/SiCNH cap interface, and correlated this metallic layer with additional EM enhancement. A carbonyl-based CVD-Co liner film consumed Mn, reducing its segregation and EM benefit, suggesting O-free Co liner films are strategic for Cu-alloy seed extendibility." @default.
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• W1999349731 date "2012-12-01" @default.
• W1999349731 modified "2023-10-05" @default.
• W1999349731 title "Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals" @default.
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• W1999349731 doi "https://doi.org/10.1109/iedm.2012.6479161" @default.
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