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- W1999412744 endingPage "105002" @default.
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- W1999412744 abstract "Ultra-fine-grained (UFG) Al-1050 processed by equal channel angular pressing and UFG Al–Mg–Cu–Mn processed by high-pressure torsion (HPT) were embossed at both room temperature and 300 °C, with the aim of producing micro-channels. The behaviour of Al alloys during the embossing process was analysed using finite element modelling. The cold embossing of both Al alloys is characterized by a partial pattern transfer, a large embossing force, channels with oblique sidewalls and a large failure rate of the mould. The hot embossing is characterized by straight channel sidewalls, fully transferred patterns and reduced loads which decrease the failure rate of the mould. Hot embossing of UFG Al–Mg–Cu–Mn produced by HPT shows a potential of fabrication of microelectromechanical system components with micro channels." @default.
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- W1999412744 date "2010-09-01" @default.
- W1999412744 modified "2023-09-25" @default.
- W1999412744 title "Microembossing of ultrafine grained Al: microstructural analysis and finite element modelling" @default.
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- W1999412744 doi "https://doi.org/10.1088/0960-1317/20/10/105002" @default.
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