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- W1999556748 abstract "In semiconductor failure analysis, Soft Defect Localization (SDL) technology is applied to localize defect that dependent on conditions such as temperature, frequency, voltage. SDL is usually used for digital failure analysis. However, to directly apply SDL in analog part is not so common. In this paper, a novel method is introduced to analyze analog signal failure at high temperature by SDL technology." @default.
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- W1999556748 date "2011-07-01" @default.
- W1999556748 modified "2023-09-23" @default.
- W1999556748 title "A novel method to analyze analog and mixed mode IC failure by Soft Defect Localization (SDL)" @default.
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- W1999556748 doi "https://doi.org/10.1109/ipfa.2011.5992712" @default.
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