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- W2000246509 abstract "In nanoimprint with UV curable resin, a mold fabricated by etching quartz by using Cr as a hard mask isgenerally used. For fine pattern fabrication, Cr fine pattern etching technology is very important. Usually, therealization of enough resolution needs a resist thickness reduction, which, however, makes it difficult to etchextremely fine Cr features with vertical sidewalls.Here, we propose a brand-new method called reverse EB process. In this method, an electron-beam (EB)resist pattern is first reversed by a plasma-robust material, with which as a mask, the Cr is then etched to forma hard mask for the mold etching. By this process, we have realized a quartz mold with patterns of 16nm inhalf pitch at minimum." @default.
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- W2000246509 date "2008-03-14" @default.
- W2000246509 modified "2023-09-23" @default.
- W2000246509 title "A method for fabricating below 22nm feature patterns in quartz mold" @default.
- W2000246509 doi "https://doi.org/10.1117/12.771561" @default.
- W2000246509 hasPublicationYear "2008" @default.
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