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- W2000273802 abstract "Reliability of the Cu/low-k structure is a serious concern since the metal/dielectric interface is generally weak. The adhesion of the Ta/polyarylene ether interfaces with and without electron beam (EB) treatment was investigated by four-point bending test, x-ray photoelectron spectroscopy, and density functional theory. Higher adhesion energy (Gc) was achieved with low-dose EB treatment, attributed to the strong Ta-arene interaction. However, high-dose EB breaks the aromatic rings partially, resulting in fewer available sites for Ta-arene bonding, leading to lower adhesion. It is suggested that the amount of carbon atoms involved in bonding with the metal is the key to improve the Ta/polymer adhesion." @default.
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- W2000273802 date "2006-06-05" @default.
- W2000273802 modified "2023-09-26" @default.
- W2000273802 title "Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface" @default.
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- W2000273802 doi "https://doi.org/10.1063/1.2212533" @default.
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