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- W2000317491 abstract "Two advanced co-planarity measurement systems are presented to investigate the warpage of non-conventional packages subjected to reflow and assembly processes. The systems implement an advanced application of two classical interferometry techniques for deformation measurement. A Twyman-Green interferometry system with sub-micron resolution and designed to accommodate horizontally mounted specimens is used to document real time deformation of assemblies subjected to thermal loading up to solder reflow temperature. A shadow moire system, employing the concept of non-zero Talbot distance to increase dynamic range, improve contrast and increase sensitivity, is used to measure process-induced warpage. Experimental results are shown to illustrate the capabilities of the designed systems." @default.
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- W2000317491 date "2007-01-01" @default.
- W2000317491 modified "2023-09-27" @default.
- W2000317491 title "Advanced Co-Planarity Measurement Tools for the Warpage Investigation of Non-Conventional Packages Caused by Reflow and Assembly Process" @default.
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- W2000317491 doi "https://doi.org/10.1109/ectc.2007.373884" @default.
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