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• W2000522077 abstract "CDM hardening during the development of technology, devices, libraries and finally products differs significantly from the process well-established for HBM. This paper introduces a method on the basis of specialized CDM test structures including protection elements and sensitive monitor elements. These test structures mimic typical CDM-sensitive circuits found by physical failure analysis over the years. Manufactured in five different technologies, structures were assembled in both a regular package and a new package emulator. CDM stress tests, very-fast TLP tests, transient interferometric mapping, device simulation, and failure analysis lead to new insights in the complex interdependencies during CDM and underline the need of CDM-specific test structures." @default.
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• W2000522077 date "2005-02-01" @default.
• W2000522077 modified "2023-10-02" @default.
• W2000522077 title "Test circuits for fast and reliable assessment of CDM robustness of I/O stages" @default.
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• W2000522077 doi "https://doi.org/10.1016/j.microrel.2004.05.014" @default.
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