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- W2000534008 abstract "The recent implementation of three-dimensional microwave cavities coupled to superconducting transmon qubits has led to dramatic improvements in qubit coherence times [1]. Besides the superconducting aluminum cavities that have been used in many such measurements, other recent experiments have utilized copper cavities [2] with coherence times now approaching 0.1 ms. We are investigating the effects on the quality factor for three-dimensional copper cavities that have the cavity-wall surfaces electropolished and coated with a superconducting tin layer. The copper base provides a good path for thermalizing the cavity walls and qubit chip, while the surface treatment reduces the microwave loss. We have measured a superconducting transmon qubit in such a cavity and we report our low-temperature coherence results on the same qubit and cavity measured in two different labs." @default.
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- W2000534008 date "2013-07-01" @default.
- W2000534008 modified "2023-09-25" @default.
- W2000534008 title "Reducing surface loss in 3D microwave copper cavities for superconducting transmon qubits" @default.
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- W2000534008 doi "https://doi.org/10.1109/isec.2013.6604283" @default.
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