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• W2000545703 abstract "A thermal cycling technique which allows grain refinement of Cu  In alloys from 400 μm to less than 10 μm has been developed. The process consists of annealing in the α phase field of a fully precipitated alloy. The time and temperature dependence of the grain size indicated a value of 0.45 for the exponent n in the general equation for the grain growth law, D = ktn. The value of n was found to be slightly dependent on temperature in a 50 deg C interval. The temperature dependence of the grain growth rate suggested an apparent activation energy Qg = 21.5 k cal/mole for the grain boundary migration. This value lies in the range of 0.4 to 0.5 of the activation energy for the diffusion of In in pure Cu, which is approximately the same value required for boundary migration. A small change in the composition from 15 wt.% In to 16.2 wt.% In balance Cu does not seem to have an appreciable effect on either the exponent n or the absolute value of the grain diameter. The apparent activation energy was also found to be independent of composition. A change in the thickness of the alloy resulted in smaller grain size but the effect was noticeable only in specimens solution annealed for longer durations. The value of the exponent decreased from 0.45 to 0.42. It has been observed that during normal grain growth in these alloys, growth continued to larger grain diameters when using single anneals than during multi anneals. The effect was noticeable only after the fourth cycle. The results were found to be in reasonable agreement with a recently proposed single boundary migration theory." @default.
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• W2000545703 date "1975-01-01" @default.
• W2000545703 modified "2023-09-23" @default.
• W2000545703 title "Grain refinement in CuIn alloys through thermal cycling" @default.
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• W2000545703 doi "https://doi.org/10.1016/0025-5416(75)90217-7" @default.
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