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- W2000561352 abstract "The thermal response to a microscopic hot spot, formed by an exponential electrostatic discharge (ESD) pulse, is analyzed and discussed, using a spherically symmetric Gaussian distribution to model the hot spot. A nonsingular solution to the three-dimensional heat equation, applicable to input protection devices in integrated circuits, is obtained. The resulting near-field temperature distribution can be used to study failures related to local silicon melting.< <ETX xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>></ETX>" @default.
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- W2000561352 modified "2023-09-27" @default.
- W2000561352 title "Thermal analysis of ESD-related hot spots (integrated circuits)" @default.
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- W2000561352 doi "https://doi.org/10.1109/16.2590" @default.
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